Europlacer is very pleased to announce that it will launch its new SMT modular pick and place at the upcoming Productronica 2009 scheduled to take place November 10 to 13 in Munich.

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This new machine called XPii is a refreshing new approach to modular pick and place. Incorporating technology from Europlacer's innovative award winning iineo platform, XPii benefits from low maintenance linear motors, high resolution digital cameras and advanced on-head optical component sensing. With these advanced features you can benefit from all the capability of iineo in a compact space and the modularity enables you to build your line to meet growing demands.

XPii uses Europlacer proven core features, such as turret head, intelligent feeders and powerful software without compromise. It is equipped with a choice of turret heads and incorporates optical sensors that can detect, on the fly, the presence of components as small as 01005 and as large as 50 x 50 mm from picking to placement. XPii will accommodate components supplied on tape, strip tape, stick and matrix tray.

The system uses Europlacer’s unique Integrated IntelligenceTM and fulfils all possible placement needs in one compact system. It is widely configurable, allowing two versions: XPii-I and XPii-II (one or two placement heads), 8 or 12 nozzles, tape trolleys or feeder trolleys, matrix tray sequencer, internal matrix tray. Unlike “traditional” chip-shooter style machines, XPii has on no restrictions or limitations on component range. The PCB in production remains stationary.

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XPii-I .....  XPii-II

Specifications