High-range, precise, shadow-free 3D height measurement of solder joints and components coupled with simultaneous high-resolution, high-quality 2D images.
A high performance easy to operate AOI system to inspect PCB assembly before reflow. Detects placement defects, missing, misalignment, billboard, up-side-down, polarity, wrong component, lifted lead and more.
Offline AOI designed to support high-mix, low-volume production. Includes state-of-art i3D technology, high-speed camera and the multidirectional lighting module.
Specifically designed for small / medium SMT shops.
With its small footprint and quiet operation, it can be used in production as well as in the lab environment.
Simultaneous 2D and 3D inspection guarantees full inspection coverage with the most accurate measurement of height, area and volume of the paste deposits.
Capture brilliant images for a variety of inspection tasks. With a resolution of 600 dpi, the image corresponds a recording of 71.6 megapixels. This is possible only with a CCD line camera!
